MERGES & ACQUISITIONS in ELECTRONIC COMPONENTS INDUSTRY - 2021 {21}

Short M&A-deals descriptions in Russian
21-Dec-2021
RENESAS completes acquisition of CELENO for $315M
15-Dec-2021
VISHAY to acquire BARRY INDUSTRIES for $21M
9-Dec-2021
SENSATA TECHNOLOGIES acquires SENDYNE
3-Nov-2021
QORVO acquires UNITEDSIC
20-Oct-2021
LITTELFUSE to acquire CARLING TECHNOLOGIES for $315M
14-Oct-2021
SIVERS SEMICONDUCTORS to acquire MIXCOMM for $135M
8-Sep-2021
TE CONNECTIVITY acquires ERNI
8-Jul-2021
CIRRUS LOGIC acquires LION SEMICONDUCTOR for $335M
7-Jul-2021
ABRACON acquires PROANT
30-Jun-2021
YAGEO acquires CHILISIN ELECTRONICS
9-Jun-2021
KAMIC Group acquires TALEMA Group
7-May-2021
UNIGEN acquires AGIGA TECH
22-Apr-2021
SKYWORKS to acquire the Infrastructure & Automotive business of SILICON LABS for $2.75B
29-Mar-2021
Wise Road Capital takes over MAGNACHIP for $1.4B
8-Mar-2021
HEICO acquires PYRAMID SEMICONDUCTOR
5-Mar-2021
NEUTRIK acquires CONNEX
3-Mar-2021
AMS completes acquisition of OSRAM
1-Mar-2021
ABRACON acquires AEL CRYSTALS
8-Feb-2021
RENESAS acquires DIALOG SEMICONDUCTOR for $5.9B
2-Feb-2021
AMPHENOL acquires POSITRONIC
1-Feb-2021
BOURNS acquires KASCHKE COMPONENTS